Fig. 9From: Role of interfaces on the mechanical response of accumulative roll bonded nanometallic laminates investigated via dislocation dynamics simulationsThe dislocation density evolution plots of, (a), the total volume averaged bulk (magenta) and junction density (tan) during the pre-strain-relaxation step of microstructure generation for a \(\{1\ 1\ 2\}/\{1\ 1\ 2\}\) (solid curves) and a \(\{1\ 1\ 0\}/\{1\ 1\ 1\}\) (dashed curves) Fe/Cu NML with 200 nm layer thickness. Like before, (b) plots the corresponding bulk dislocation density evolution for the Fe (red) and Cu (blue) layers, with (c) plotting the respective interface dislocation density evolution (gray) for the two NMLs. The transmission propensity as a function of plausible transmission events from the Fe to the Cu phase is also plotted in (d) during the microstructure generation stepBack to article page