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Fig. 5 | Journal of Materials Science: Materials Theory

Fig. 5

From: Role of interfaces on the mechanical response of accumulative roll bonded nanometallic laminates investigated via dislocation dynamics simulations

Fig. 5

a plots the total volume averaged bulk (magenta) and junction density (tan) evolution during the pre-strain-relaxation step of microstructure generation for both 200 nm (solid curves) and 400 nm (dashed curves) layer thicknesses for a \(\{1\ 1\ 2\}/\{1\ 1\ 2\}\) Fe/Cu NML. Similarly, (b) plots the corresponding bulk dislocation density evolution for the Fe (red) and Cu (blue) layers, and (c) plots the interface dislocation density evolution in both areal (gray) and linear (red) units. Finally, the transmission propensity as a function of plausible transmission events from the Fe to the Cu phase is also plotted in (d) during the microstructure generation step. In each of the figures, the solid lines correspond to the mean result from \(\approx\) 15 simulations, with the filled area highlighting the standard deviation between the runs for all the plots. Also, the gray lines in (d) correspond to the (mean) number of these transmission events normalized by the average interface density for both 200 nm (solid) and 400 nm (dashed) undermine their role on the respective transmission propensity

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