Fig. 13From: Role of interfaces on the mechanical response of accumulative roll bonded nanometallic laminates investigated via dislocation dynamics simulationsThe dislocation density evolution for the individual slip systems in the Cu, (a), and the Fe, (b), under shear compression loading is plotted as a function of average von Mises strain for one of the 4 runs shown in Fig. 7, for a 400 nm thick Fe/Cu NML with a \(\{1\ 1\ 2 / 1\ 1\ 2\}\) interface. d plots the corresponding averaged dislocation density evolution in the bulk (magenta), interface (gray), Fe bulk (red), and Cu bulk (blue), along with the bulk junction density (tan). The macroscopic shear stress-strain response with the number of transmission events is also plotted in (e). The relaxed dislocation microstructure at the start of loading and the final deformed configuration are shown in (c) and (f), respectivelyBack to article page